The difference between COG/COF/COP packaging technology
When it comes to packaging technology, this involves COG, COF, and COP packaging technologies. These packaging technologies usually involve driver ICs and FPC cables. The driver IC refers to controlling the brightness of different pixels on the screen by controlling the voltage of the liquid crystal layer, and the FPC is the carrier of the display module and the main board. The screen packaging processes composed of these modules are COG, COF, COP.
COG is Chip On Glass. This technology refers to the technology in which IC chips and FPC cables are placed directly on the glass of the screen backplane.
COF is Chip On Film. This technology refers to embedding the IC chip into the flexible FPC cable, and then using the flexible characteristics of the FPC to fold it under the screen. In this technology, the space occupied by the IC chip is reduced. Released, so the width of the lower border of the screen is reduced. This technology is used in many screen technologies.
COP is Chip On Pi. This technology is the technology that reduces the frame the most, but this technology is only used in flexible OLED screens. This technology uses the characteristics of flexible OLED screens to bend all the cables and ICs to the bottom of the entire screen. . This technology has high packaging cost and low yield rate, so it has not been popularized in the market.
These packaging technologies are also used in our company's LCD and OLED screens, so you can carefully observe whether it is COG, COF or COP technology when purchasing our company's products.
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